As the demand for high-resolution content, virtual reality (VR), augmented reality (AR), autonomous driving, and the Internet of Things (IoT) continues to rise, the production and consumption of data are soaring.
To effectively share and transmit this data, high-frequency waves are employed, particularly the 28GHz band used in 5G communication.
These high-frequency waves can quickly transfer large amounts of data due to their short wavelengths.
However, the right materials and equipment are crucial to utilize them effectively, as these waves are sensitive to obstacles.
Think of high-frequency waves like water flowing through a pipe. At low speeds, the water isn’t much affected by the thickness or any protrusions in the pipe.
But at high velocities, those same obstacles can significantly hinder the flow. Similarly, high-frequency waves struggle to propagate efficiently when encountering barriers, often resulting in signal loss.
In response to these challenges, a South Korean startup named Copper Innovation Technologies (CIT) is making significant strides with its next-generation flexible copper-clad laminated film (FCCL).
This innovative material minimizes signal loss in high-frequency applications, enabling faster and more reliable data transmission.
CEO Jeong Seung shared insights about the groundbreaking product at the CES 2025 Global Media Meetup organized by AVING News in Seoul.
Copper usage
He explained that his journey with copper began with studies in dielectric and magnetic materials, evolving into a deep dive into the properties of copper itself.
Jeong highlighted that while copper is a common material, creating it as a single crystal can dramatically alter its properties.
Single crystals are characterized by atoms aligned in a perfect direction, greatly enhancing electrical performance.
To achieve this, CIT uses substrates like sapphire or magnesium oxide, allowing the film’s structure to reflect that of the substrate.
This process is intricate, but CIT’s new technology allows for the development of single crystal structures without compromising the integrity of the substrate.
The result? Single crystal wires that offer noise-free signal transmission, eliminating grain boundary scattering that typically disrupts signals.
Jeong emphasized that with this understanding of single crystals, CIT is committed to integrating this technology into all aspects of their business.
The focus now lies on producing electronic circuits on Teflon, which will apply to flexible printed circuit boards (PCBs) and flexible FCCL.
These advancements will pave the way for flexible PCBs that can be integrated into devices like iPhones and Galaxy smartphones.
The unique properties of CIT’s material feature low dielectric constants and losses, leading to more efficient signal transmission and reduced power consumption.
Antenna
CIT’s flexible materials offer wide-ranging applications. They can enhance audio devices and various measurement systems, making them ideal for extensive facilities such as MRI machines and other observation systems.
The flexibility of these materials not only saves space but also allows for innovative design possibilities.
CIT has recently published a paper in the renowned scientific journal *Nature*, highlighting their unique technology.
Traditional methods for film deposition often involve costly sputtering techniques, but CIT’s approach allows for larger-scale, more affordable deposition systems.
The challenge CIT faced was managing atom clusters during sputtering, which typically resulted in poor adhesion to substrates.
However, their refined technique deposits individual atoms one at a time, significantly enhancing the adhesion quality and reducing noise during the process.
As the telecommunications landscape rapidly evolves, the groundbreaking achievements of CIT in developing flexible copper-clad laminate materials and innovative atomic sputtering epitaxy technology position the company as a leading force in high-speed communication.
With a focus on sustainability, CIT is harnessing recycled copper in their production, blending impressive performance with environmental responsibility. As millimeter-wave technology evolves, CIT is strategically positioned to play a crucial role in the future of wireless communication.
The company will showcase its product at CES 2025 in Las Vegas in January.
